Download Advanced MEMS packaging by John H. Lau ... [et al.] PDF

By John H. Lau ... [et al.]

Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2007. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05.

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MEMS packaging with improved reaction to temperature changes,” Strei, David (US), CN101098825 (A)—2008-01-02. 56. “Method and system for sealing packages for optics,” Yang, Xiao (US), Chen, Dongmin (US), US2008014682 (A1)—200801-17. 57. “MEMS microphone packaging structure,” Pan, Zhengmin (CN), CN200994191 (Y)—2007-12-19. 58. “Multiple internal seal ring micro-electro-mechanical system vacuum packaging method,” Hayworth, Ken J. (US), Yee, Karl Y. (US) (+5), US2007298542 (A1)—2007-12-27. 59. “Method for forming a hermetically sealed cavity,” Witvrouw, Ann (BE), Rico, Raquel H.

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