Download Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin PDF

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

A complete consultant to 3D MEMS packaging tools and strategies Written through specialists within the box, complex MEMS Packaging serves as a helpful reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor provides state of the art MEMS (microelectromechanical structures) packaging innovations, comparable to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, inventive, high-performance, strong, and low in cost packaging innovations for MEMS units. The ebook also will relief in stimulating extra learn and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, approaches, production, trying out, and reliability. one of the subject matters explored: complex IC and MEMS packaging developments MEMS units, advertisement functions, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding ideas Actuation mechanisms and built-in micromachining Bubble swap, optical swap, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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133. “Passive devices and modules for transceiver and manufacturing method thereof,” Song, In Sang (KR), KR20020095728 (A)—2002-12-28. 134. “MEMS device for wafer level packaging and method for fabricating the same,” Jin, Jang Seok (KR), KR20020058223 (A)— 2002-07-12. 135. , III (US) (+2), US2006194361 (A1)—2006-08-31. 35 36 Chapter One 136. “Optical fiber MEMS pressure sensor packaging structure,” Li, Wang Ming (CN), CN2811965 (Y)—2006-08-30. 137. “Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device,” Wu, Liu Yufei (CN), CN1821052 (A)—2006-08-23.

8. “Apparatus for downhole fluids analysis utilizing micro electro mechanical systems (MEMS) or other sensors,” Terabayashi, Toru (VG), Sugimoto, Tsutomu (VG) (+3), CN101309853 (A)— 2008-11-19. 9. “MEMS device vacuum encapsulation method,” Jin, Yufeng (CN), Zhang, Yangfei (CN) (+2), CN101301993 (A)—2008-11-12. 10. “Packaging body and packaging component for microphone of micro electro-mechanical systems,” Huang, Zhaoda (CN), Jian, Xintang (CN), CN101316462 (A)—2008-12-03. 11. “Packaging body and packaging component for microphone of micro electro-mechanical systems,” Huang, Zhaoda (CN), Jian, Xintang (CN), CN101316461 (A)—2008-12-03.

Packaging of Micro Devices,” O’Mahony, Conor (IE), Hill, Martin (IE), US2008145976 (A1)—2008-06-19. 36. “High-aspect-ratio metal-polymer composite structures for nano interconnects,” Aggarwal, Ankur (US), Raj, Pulugurtha Markondeya (US) (+1), US2008136035 (A1)—2008-06-12. 37. “MEMS package and packaging method thereof,” Jung, Sung-Hae (KR), Lee, Myung-Lae (KR) (+4), WO2008069394 (A1)—2008-06-12. 38. “Integrated thermal systems,” Henderson, H. Thurman (US), Shuja, Ahmed (US) (+3), US2008128898 (A1)—2008-06-05.

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